The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

May. 26, 2017
Applicant:

Nisshin Steel Co., Ltd., Tokyo, JP;

Inventors:

Atsuo Shimizu, Osaka, JP;

Masanori Matsuno, Osaka, JP;

Masaya Yamamoto, Osaka, JP;

Hirofumi Taketsu, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 2/06 (2006.01); C23C 2/26 (2006.01); C23C 22/62 (2006.01); C23C 18/48 (2006.01); C23C 2/40 (2006.01); B32B 15/01 (2006.01); C23F 11/06 (2006.01); C22C 18/00 (2006.01); C22C 18/04 (2006.01); C23C 22/36 (2006.01); C23C 22/78 (2006.01); C22C 21/10 (2006.01); C23C 2/12 (2006.01); C23C 2/28 (2006.01);
U.S. Cl.
CPC ...
C23C 2/06 (2013.01); B32B 15/013 (2013.01); C22C 18/00 (2013.01); C22C 18/04 (2013.01); C22C 21/10 (2013.01); C23C 2/12 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/40 (2013.01); C23C 18/48 (2013.01); C23C 22/361 (2013.01); C23C 22/62 (2013.01); C23C 22/78 (2013.01); C23F 11/06 (2013.01);
Abstract

A method of producing a hot-dip Zn alloy-plated steel sheet includes: dipping a base steel sheet in a hot-dip Zn alloy plating bath to form a hot-dip Zn alloy plating layer on a surface of the base steel sheet; and contacting an aqueous solution containing a water-soluble corrosion inhibitor with a surface of the hot-dip Zn alloy plating layer to cool the base steel sheet and the hot-dip Zn alloy plating layer having a raised temperature through formation of the hot-dip Zn alloy plating layer. A temperature of the surface of the hot-dip Zn alloy plating layer when the aqueous solution is to be contacted with the surface of the hot-dip Zn alloy plating layer is equal to or more than 100° C. and equal to or less than a solidifying point of the plating layer. The aqueous solution containing the water-soluble corrosion inhibitor satisfies the Equation [{(Z−Z)/Z}100≥20].


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