The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Jun. 30, 2016
Applicant:

National Research Council of Canada, Ottawa, CA;

Inventors:

Ta-Ya Chu, Ottawa, CA;

Christophe Py, Ottawa, CA;

Ye Tao, Ottawa, CA;

Zhiyi Zhang, Ottawa, CA;

Afshin Dadvand, Ottawa, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/00 (2006.01); C09D 11/52 (2014.01); H01L 29/772 (2006.01); H01L 51/00 (2006.01); H01L 51/05 (2006.01); H01L 51/10 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); H01L 29/772 (2013.01); H01L 51/0022 (2013.01); H01L 51/0023 (2013.01); H01L 51/0508 (2013.01); H01L 51/105 (2013.01); H05K 1/16 (2013.01);
Abstract

Disclosed is a method of printing ultranarrow-gap lines of a functional material, such as an electrically conductive silver ink. The method entails providing a substrate having an interlayer coated on the substrate and printing the ultranarrow-gap lines by depositing ink on the interlayer of the substrate, the ink comprising the functional material and a solvent that swells the interlayer to cause the interlayer to bulge at edges of the ink to thereby define embankments that confine the ink.


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