The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Apr. 15, 2016
Tanazawa Hakkosha Co., Ltd., Osaka, JP;
Masayuki Sakai, Higashiosaka, JP;
Hisao Aota, Higashiosaka, JP;
TANAZAWA HAKKOSHA CO., LTD., Osaka, JP;
Abstract
To provide a resin molding mold capable of forming a resin molded product having embossing in which by controlling appearance of gloss, its texture is improved, and the resin molded product is prevented from occurrence of white blurring on the surface on which the molded embossing is formed. A resin molding mold in accordance with the present application is used for molding a resin molded product having embossing formed thereon. The resin molding mold includes a molding mold and a buffer layer formed on an inside mold surface of the molding mold. The buffer layer is formed by a mixture of a thermosetting resin and fine particles having substantially spherical shapes. The fine particles have a bulk specific gravity in a range from 0.4 g/ml or more to 0.9 g/ml or less, and on the surface of the buffer layer, a plurality of gloss adjusting convex portions having substantially spherical shapes derived from the fine particles are formed.