The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Mar. 30, 2017
Applicant:

The Procter & Gamble Company, Cincinnati, OH (US);

Inventors:

Uwe Schneider, Cincinnati, OH (US);

Horst Blessing, Cincinnati, OH (US);

Hans Adolf Jackels, Mechernich, DE;

Assignee:

The Procter & Gamble Company, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61F 13/15 (2006.01); B32B 37/06 (2006.01); A61F 13/496 (2006.01); B32B 37/10 (2006.01); B32B 37/30 (2006.01); B32B 38/00 (2006.01); A61F 13/49 (2006.01); B29C 65/10 (2006.01); B29C 65/00 (2006.01); B29L 31/48 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
A61F 13/15739 (2013.01); A61F 13/49058 (2013.01); A61F 13/4963 (2013.01); B29C 65/10 (2013.01); B29C 66/1122 (2013.01); B29C 66/133 (2013.01); B29C 66/21 (2013.01); B29C 66/43 (2013.01); B29C 66/431 (2013.01); B29C 66/729 (2013.01); B29C 66/7294 (2013.01); B29C 66/73116 (2013.01); B29C 66/8226 (2013.01); B29C 66/8242 (2013.01); B29C 66/8351 (2013.01); B29C 66/83221 (2013.01); B29C 66/83411 (2013.01); B29C 66/83511 (2013.01); B32B 37/06 (2013.01); B32B 37/065 (2013.01); B32B 37/10 (2013.01); B32B 37/30 (2013.01); B32B 38/0004 (2013.01); A61F 2013/15829 (2013.01); A61F 2013/15878 (2013.01); B29C 66/71 (2013.01); B29C 66/723 (2013.01); B29C 66/93411 (2013.01); B29K 2101/12 (2013.01); B29L 2031/4878 (2013.01); B32B 2309/02 (2013.01); B32B 2309/04 (2013.01); B32B 2309/12 (2013.01); B32B 2398/20 (2013.01); B32B 2555/02 (2013.01); Y10T 156/1052 (2015.01); Y10T 156/1054 (2015.01); Y10T 156/17 (2015.01);
Abstract

An apparatus for joining substrate portions includes substrate portions being positioned such that the substrate portions overlap at an overlap area. The substrate portions each have a melting temperature and an outer surface. A fluid is heated to a temperature sufficient to at least partially melt the substrate portions. A jet of the heated fluid is directed from a fluid orifice onto the substrate portions at the overlap area. The heated fluid penetrates at least one of the outer surfaces of the substrate portions. The substrate portions are at least partially melted using the heated fluid. The substrate portions are compressed using a pressure applying surface adjacent the fluid orifice to join the substrate portions together at the overlap area.


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