The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Mar. 30, 2015
Applicant:

Exascaler Inc., Chiyoda-ku, Tokyo, JP;

Inventor:

Motoaki Saito, Tokyo, JP;

Assignee:

EXASCALER INC., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20236 (2013.01); G06F 1/20 (2013.01); G06F 1/206 (2013.01); H01L 23/473 (2013.01); H05K 7/20 (2013.01); H05K 7/20263 (2013.01);
Abstract

Provided is a cooling system capable of improving the cooling performance of an electronic device and being simple and efficient. The cooling system has a cooling tank, and the cooling tank contains in its open space a second cooling liquid having a boiling point T. An electronic device mounting a processor as a heating element on a board is stored within the open space of the cooling tank and is immersed in the second cooling liquid. A boiling cooling device is a cooling device thermally connected to the processor and encloses a first cooling liquid having a boiling point T(provided T=Tor T<T). A first heat exchanger is immersed in a surface layer portion of the second cooling liquid within the cooling tank. The first heat exchanger encloses therein a third refrigerant having a boiling point T(provided T=Tor T>T).


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