The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Jul. 20, 2016
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Philip Georg Brockerhoff, Munich, DE;
Tilo Weide, Zorneding, DE;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 3/30 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/306 (2013.01); H05K 1/182 (2013.01); H05K 3/325 (2013.01); H05K 2201/09709 (2013.01); H05K 2201/1059 (2013.01); H05K 2201/10545 (2013.01);
Abstract
A method for mounting components on a printed circuit board comprising the following steps: Arranging a first component on a first surface of the printed circuit board and a second component on a second surface of the printed circuit board, wherein the first component occupies a laterally overlapping position with the second component; and applying a first force to the first component for mounting it on the printed circuit board and/or applying a second force to the second component for mounting it on the printed circuit board. Further, a printed circuit board is suggested.