The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Mar. 10, 2016
Applicant:

Delta Electronics (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Hai-Bin Xu, Shanghai, CN;

Tao Wang, Shanghai, CN;

Shou-Yu Hong, Shanghai, CN;

Zhen-Qing Zhao, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/14 (2006.01); H05K 3/30 (2006.01); H05K 5/06 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/30 (2013.01); H05K 3/284 (2013.01); H05K 5/064 (2013.01); H05K 7/1432 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/1316 (2013.01); Y02P 70/611 (2015.11);
Abstract

A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.


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