The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Feb. 27, 2017
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Kuniaki Yosui, Nagaokakyo, JP;
Bunta Okamoto, Nagaokakyo, JP;
Isamu Morita, Nagaokakyo, JP;
Jun Sasaki, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A process of manufacturing a multilayer circuit board includes patterning insulating substrates on which conductors are formed to provide a signal conductor, a first ground conductor, and a second ground conductor. The insulating substrates including the signal conductor, the first ground conductor, and the second ground conductor are stacked and thermally crimped to form a laminate. An interlayer connection conductor is formed on a surface of the laminate by a Laser Direct Structuring process.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile