The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Dec. 04, 2015
Applicant:

Invensense, Inc., San Jose, CA (US);

Inventors:

Carlo Murgia, Sunnyvale, CA (US);

James Lim, Saratoga, CA (US);

Fariborz Assaderaghi, Emerald Hills, CA (US);

Anthony Minervini, Palos Hills, IL (US);

Assignee:

INVENSENSE, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 3/00 (2006.01); H04R 1/04 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 3/005 (2013.01); H04R 1/04 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 2201/003 (2013.01); H04R 2430/20 (2013.01);
Abstract

Systems and techniques for providing improved beam forming functionality and/or improve noise cancellation functionality in a microphone package are presented. In an implementation, a device includes a first microelectromechanical systems (MEMS) sensor, a second MEMS sensor, and a digital signal processor. The first MEMS sensor is contained in a first back cavity within the device. The second MEMS sensor is contained in a second back cavity within the device. The digital signal processor generates a cardioid microphone pattern based on data associated with the first MEMS sensor contained in the first back cavity and other data associated with the second MEMS sensor contained in the second back cavity, where the digital signal processor forms at least a portion of the first back cavity and the second back cavity.


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