The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

May. 20, 2016
Applicant:

Oculus Vr, Llc, Menlo Park, CA (US);

Inventors:

Quintin Morris, Issaquah, WA (US);

James Stocker Webb, Seattle, WA (US);

Mark Shintaro Ando, Seattle, WA (US);

Peter Wesley Bristol, Seattle, WA (US);

David Tao, Santa Clara, CA (US);

Daniel James Faulkner, Portland, OR (US);

Assignee:

Oculus VR, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 1/10 (2006.01);
U.S. Cl.
CPC ...
H04R 1/1058 (2013.01); H04R 1/1016 (2013.01); H04R 1/1033 (2013.01); H04R 1/1075 (2013.01); H04R 2499/15 (2013.01);
Abstract

An earbud assembly with separate, flexible overmold sections configured to cover a seam between adjacent portions of an underling earbud housing. The earbud assembly includes a first housing member and a second housing member attached to the first housing member and forming enclosure with the first housing member that houses an audio transducer. A first flexible overmold is formed on an first exterior surface of the first housing member, and a second flexible overmold is formed on an exterior surface of the second housing member. The flexible overmolds each include an edge portion along their perimeters. Each edge portion is configured to abut the other and thereby cover the seam of the earbud housing.


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