The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Mar. 20, 2017
Applicant:

Htc Corporation, Taoyuan, TW;

Inventors:

Tiao-Hsing Tsai, Taoyuan, TW;

Chien-Pin Chiu, Taoyuan, TW;

Hsiao-Wei Wu, Taoyuan, TW;

Yi-Hsiang Kung, Taoyuan, TW;

Li-Yuan Fang, Taoyuan, TW;

Assignee:

HTC CORPORATION, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03M 1/00 (2006.01); H04M 1/02 (2006.01); H01Q 1/24 (2006.01); G05F 3/08 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2006.01); H01L 29/868 (2006.01); H03K 17/74 (2006.01); H01L 23/00 (2006.01); H04W 88/08 (2009.01);
U.S. Cl.
CPC ...
H04M 1/0277 (2013.01); G05F 3/08 (2013.01); H01L 23/66 (2013.01); H01L 25/16 (2013.01); H01L 29/868 (2013.01); H01Q 1/24 (2013.01); H03K 17/74 (2013.01); H01L 24/48 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2924/00015 (2013.01); H01L 2924/12031 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/3011 (2013.01); H04W 88/08 (2013.01);
Abstract

A wireless communication device that has a circuit board, an RF signal module, a capacitive touch-sensing component, or a functional component, and an antenna component is provided. The touch-sensing signal module is disposed on the circuit board. The capacitive touch-sensing component includes a sensing layer and a ground layer. The sensing layer is electrically connected to the touch-sensing signal module. The antenna component includes a feed point and a radiating body. The feed point is disposed on the ground layer and is electrically connected to the RF single module. The radiating body incorporates at least parts of the ground layer. Alternatively, the feed point is disposed on the sensing layer, and the radiating body incorporates at least parts of the sensing layer. Therefore, the radiating body is incorporated into the sensing layer or ground layer of the capacitive touch-sensing component and can save accommodating space.


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