The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Oct. 27, 2017
Applicant:

Luxtera, Inc., Carlsbad, CA (US);

Inventors:

Mark Peterson, San Diego, CA (US);

Greg Young, Irvine, CA (US);

Peter De Dobbelaere, San Diego, CA (US);

Assignee:

Luxtera, Inc., Carlsbad, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/43 (2013.01); G02B 6/122 (2006.01); H01L 21/84 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2006.01); H04B 10/80 (2013.01); H01L 27/12 (2006.01); H04B 10/70 (2013.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
H04B 10/43 (2013.01); G02B 6/1225 (2013.01); H01L 21/84 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 25/167 (2013.01); H01L 27/1203 (2013.01); H04B 10/70 (2013.01); H04B 10/801 (2013.01); H05K 999/99 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12142 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01);
Abstract

Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an external optical source, from an optical source assembly via optical fibers coupled to the silicon photonic interposer. A modulated optical signal may be generated by processing the received CW optical signals based on a first electrical signal received from the electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signals, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of: a processor core, a switch core, memory, or a router.


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