The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Dec. 06, 2012
Applicant:

Infineon Technologies Americas Corp., El Segundo, CA (US);

Inventors:

Zhou Chen, Seal Beach, CA (US);

Toshio Takahashi, Rancho Palos Verdes, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 7/537 (2006.01); H02M 1/42 (2007.01); H02H 7/122 (2006.01); H02M 1/00 (2006.01);
U.S. Cl.
CPC ...
H02M 7/537 (2013.01); H02M 1/4225 (2013.01); H02H 7/122 (2013.01); H02M 2001/007 (2013.01); Y02B 70/126 (2013.01); Y02P 80/112 (2015.11);
Abstract

According to an exemplary implementation, a power module package includes a multi-phase inverter. The power module package also includes a multi-phase inverter driver configured to drive the multi-phase inverter. The power module package further includes a power factor correction (PFC) circuit where the PFC circuit is configured to regulate a bus voltage of the multi-phase inverter and a PFC driver configured to drive the PFC circuit. The multi-phase inverter, the multi-phase inverter driver, the PFC circuit, and the PFC driver are situated on a package substrate of the power module package. The multi-phase inverter driver and the PFC driver can be in a common driver integrated circuit (IC).


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