The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Jul. 19, 2016
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventor:

Shingo Tanisaka, Komatsushima, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02 (2006.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02252 (2013.01); H01S 5/02292 (2013.01); H01S 5/02208 (2013.01); H01S 5/02256 (2013.01); H01S 5/02469 (2013.01); H01S 5/4031 (2013.01);
Abstract

A method for manufacturing an optical member includes providing a silicon substrate having a first main surface of a {110} plane, forming a mask pattern having an opening extending in a <100> direction on the first main surface of the silicon substrate, and forming a sloped surface of a {100} plane in the silicon substrate by wet etching the silicon substrate from a first main surface side using the mask pattern as a mask. A method for manufacturing a semiconductor laser device includes fixing the optical member formed by the method for manufacturing the optical member and a semiconductor laser element to a mounting board so that laser light emitted from the semiconductor laser element is irradiated to a reflective film of the optical member.


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