The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Apr. 14, 2016
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventor:

Corie Lynn Cobb, Mountain View, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 4/04 (2006.01); H01M 10/04 (2006.01); B29C 47/14 (2006.01); B05C 5/02 (2006.01); B29C 47/06 (2006.01); B29C 47/00 (2006.01); B29C 47/02 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01M 4/0483 (2013.01); B05C 5/02 (2013.01); B29C 47/065 (2013.01); B29C 47/145 (2013.01); H01M 4/0411 (2013.01); H01M 10/0404 (2013.01); B29C 47/0021 (2013.01); B29C 47/025 (2013.01); B29L 2031/3468 (2013.01); H01M 4/0435 (2013.01);
Abstract

A co-extrusion print head capable of extruding at least two layers vertically in a single pass having a first inlet port connected to a first manifold, a first series of channels connected to the first inlet port arranged to receive a first fluid from the first inlet port, a second inlet port connected to one of either a second manifold or the first manifold, a second series of channels connected to the second inlet port arranged to receive a second fluid from the second inlet port, a merge portion of the print head connected to the first and second series of channels, the merge portion arranged to receive the first and second fluids, and an outlet port connected to the merge portion, the outlet port arranged to deposit the first and second fluids from the merge portion as a vertical stack on a substrate.


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