The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Jul. 30, 2015
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Toshiaki Hamaguchi, Fujimi-machi, JP;

Eiju Hirai, Minowa-machi, JP;

Tsuyoshi Yoda, Matsumoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/25 (2013.01); H01L 41/29 (2013.01); H01L 41/047 (2006.01); H01L 41/08 (2006.01); H01L 41/09 (2006.01); H01L 41/312 (2013.01); H01L 41/319 (2013.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
H01L 41/25 (2013.01); B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1623 (2013.01); B41J 2/1629 (2013.01); B41J 2/1646 (2013.01); H01L 41/0475 (2013.01); H01L 41/0815 (2013.01); H01L 41/0973 (2013.01); H01L 41/29 (2013.01); H01L 41/312 (2013.01); H01L 41/319 (2013.01); B41J 2002/14241 (2013.01); B41J 2002/14491 (2013.01);
Abstract

A manufacturing method of a piezoelectric element includes forming an adhesive layer of a lead electrode on a piezoelectric element main body of a vibration plate, forming a metallic layer of the lead electrode on the adhesive layer, removing the metallic layer to leave the adhesive layer in a portion that corresponds to an extended electrode of the lead electrode using etching, patterning the remaining adhesive layer as individual extended electrodes that correspond to the piezoelectric element main body using etching, joining a protective substrate onto the vibration plate in a state in which the piezoelectric element main body is accommodated inside an accommodation hollow section and the extended electrode is positioned further on an outer side of the vibration plate than the protective substrate, layering and forming a section of the wiring on the protective substrate and the extended electrode, and patterning the wiring as individual wiring for each extended electrode using etching.


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