The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Dec. 09, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventor:

Jong Sup Song, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 2933/0041 (2013.01);
Abstract

There is provided a method for manufacturing a semiconductor light emitting device package including steps of disposing a plurality of light emitting structures on a support substrate, each light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, shaping a mixture containing a wavelength conversion material and a glass composition on the plurality of light emitting structures, sintering the mixture to form a wavelength conversion part, removing the support substrate, and cutting the plurality of light emitting structures into individual device units.


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