The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Feb. 23, 2017
Applicants:

Yeong Dae Lim, Suwon-si, KR;

Seung Jae Jung, Suwon-si, KR;

Inventors:

Yeong Dae Lim, Suwon-si, KR;

Seung Jae Jung, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 23/528 (2006.01); H01L 27/11565 (2017.01); H01L 29/423 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 23/528 (2013.01); H01L 27/11565 (2013.01); H01L 29/1037 (2013.01); H01L 29/4234 (2013.01);
Abstract

A semiconductor device includes a substrate, a stacked structure on the substrate, and a vertical structure in a hole passing through the stacked structure. The stacked structure includes units stacked on top of each other in a direction perpendicular to a top surface of the substrate. The units include first units and second units between the first units. Each of the first units includes a first interlayer insulating layer on a first gate, and each of the second units includes a second interlayer insulating layer on a second gate. A ratio of a thickness of the second interlayer insulating layer with respect to a thickness of the second gate is different from a ratio of a thickness of the first interlayer insulating layer with respect to a thickness of the first gate.


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