The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Oct. 21, 2014
Applicant:
Nikon Corporation, Chiyoda-ku, Tokyo, JP;
Inventor:
Alton H. Phillips, East Palo Alto, CA (US);
Assignee:
Nikon Corporation, , JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 23/00 (2006.01); B32B 37/10 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B32B 37/10 (2013.01); H01L 21/67092 (2013.01); B32B 2037/1063 (2013.01); B32B 2457/14 (2013.01); H01L 2224/8312 (2013.01); H01L 2224/83203 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/15787 (2013.01);
Abstract
A wafer bonding system and method using a combination of heat and a pneumatic force to bond two wafers held together in alignment. The wafers are heated via a non-contact, gaseous interface, thermal path between heating elements and the wafers. The pneumatic force is created by a pressure differential between a first pressure surrounding the two wafers and a second pressure, which is less than the first pressure, maintained between the two wafers.
Phillips, Alton. (2018). Wafer bonding system and method (U.S. Patent No. 10121760). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10121760
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile