The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Jun. 27, 2017
Applicant:

Schweizer Electronic Ag, Schramberg, DE;

Inventors:

Thomas Gottwald, Dunningen, DE;

Christian Roessle, St. Georgen, DE;

Assignee:

SCHWEIZER ELECTRONIC AG, Schramberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/58 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49861 (2013.01); H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/49827 (2013.01); H01L 23/58 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/074 (2013.01); H01L 25/50 (2013.01); H01L 23/3675 (2013.01); H01L 24/83 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33051 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

The invention relates to an electronic component, namely a printed circuit board element comprising a first semiconductor component () which is arranged on an upper side of an electrically conductive intermediate plate () such that a connector pad () of the semiconductor component () is electrically contacted with the intermediate plate () and comprising a second semiconductor component () which is arranged on a lower side of the intermediate plate (). The second semiconductor component () comprises a first connector pad () and a second connector pad (), wherein both connector pads () are aligned in the direction of the intermediate plate () and wherein the first connector pad () is contacted with the intermediate plate (), and wherein the second connector pad () is not contacted with the intermediate plate (). Moreover, the invention relates to a method for producing such a printed circuit board element.


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