The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Oct. 16, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Yoshitaka Kimura, Tokyo, JP;
Yoshitaka Otsubo, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); H01L 23/49 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49 (2013.01); H01L 23/142 (2013.01); H01L 24/48 (2013.01); H01L 25/18 (2013.01); H01L 29/7395 (2013.01); H01L 29/861 (2013.01); H01L 2224/4816 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01);
Abstract
A semiconductor device includes: a base plate including a metallic base plate and an insulating film provided on the metallic base plate; a semiconductor chip provided on the base plate; a control board disposed above the semiconductor chip; and a relay terminal connected to a signal electrode of the semiconductor chip through a signal line wire, extending to the control board, and connected to the control board, wherein the relay terminal is directly fixed to the insulating film of the base plate.