The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Jul. 25, 2016
Power electronics assemblies having a semiconductor device with metallized embedded cooling channels
Toyota Motor Engineering & Manufacturing North America, Inc., Erlanger, KY (US);
Toyota Jidosha Kabushiki Kaisha, Aichi-ken, JP;
Ercan M. Dede, Ann Arbor, MI (US);
Kyosuke Miyagi, Ann Arbor, MI (US);
Yuji Fukuoka, Northville, MI (US);
Toyota Motor Engineering & Manufacturing North America, Inc., Erlanger, KY (US);
Abstract
A power electronics assembly having a semiconductor device that includes a first device surface opposite a second device surface, a semiconductor substrate layer that extends from the first device surface to a substrate-drift interface, a semiconductor drift layer that extends from the substrate-drift interface towards the second device surface, and a semiconductor fluid channel is positioned within the semiconductor substrate layer of the semiconductor device. Further, the semiconductor fluid channel includes an inner surface. Moreover, a fluid channel metallization layer is positioned along the inner surface of the semiconductor fluid channel.