The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Apr. 13, 2017
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Kok Tee Lau, Melaka, MY;
Jayaganasan Narayanasamy, Melaka, MY;
Assignee:
INFINEON TECHNOLOGIES AUSTRIA AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3731 (2013.01); H01L 21/4882 (2013.01); H01L 23/3672 (2013.01);
Abstract
According to an embodiment of a method, the method includes forming a first thermally conductive layer on an outer surface of a semiconductor package. The first thermally conductive layer formed on the outer surface of the semiconductor package is configured to be mounted to an external heat sink.