The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Aug. 29, 2017
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Hirokazu Saito, Tokyo, JP;

Takuya Hagiwara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); H01L 21/68 (2006.01); H01L 21/027 (2006.01); H01L 21/47 (2006.01); H01L 21/033 (2006.01); H01L 21/225 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32139 (2013.01); H01L 21/0273 (2013.01); H01L 21/0332 (2013.01); H01L 21/2253 (2013.01); H01L 21/47 (2013.01); H01L 21/682 (2013.01);
Abstract

A method of manufacturing a semiconductor device includes forming a reference pattern in an inspection pattern formation region, forming a first mask layer over a semiconductor substrate, while forming a first inspection pattern in the inspection pattern formation region, and measuring a first amount of misalignment of the first inspection pattern with respect to the reference pattern. The method further includes implanting ions into the semiconductor substrate using a first mask layer, removing the first mask layer and the first inspection pattern and then forming a second mask layer over the semiconductor substrate, while forming a second inspection pattern in the inspection pattern formation region, and measuring a second amount of misalignment of the second inspection pattern with respect to the reference pattern. In plan view, the second inspection pattern is larger than the first inspection pattern and covers the entire region where the first inspection pattern is formed.


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