The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Jun. 09, 2017
Applicant:
Ckd Corporation, Komaki-shi, Aichi, JP;
Inventors:
Akihiro Ito, Komaki, JP;
Masayuki Kouketsu, Komaki, JP;
Takashi Yamaguchi, Osaka, JP;
Takeshi Fukuda, Osaka, JP;
Assignee:
CKD Corporation, Komaki-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 41/12 (2006.01); H01F 5/06 (2006.01); H01F 7/08 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 7/06 (2006.01);
U.S. Cl.
CPC ...
H01F 41/125 (2013.01); H01F 5/003 (2013.01); H01F 5/06 (2013.01); H01F 7/08 (2013.01); H01F 27/2876 (2013.01); H01F 27/322 (2013.01); H01F 27/323 (2013.01); H01F 41/041 (2013.01); H01F 41/122 (2013.01); H01F 2007/068 (2013.01);
Abstract
A method produces a coil sheet from an initial coil sheet in which a conductor layer, a thermally resistant insulating layer, a thermosetting, uncured adhesive layer, and a base layer are stacked in this order. The method includes a first cutting step of cutting the conductor layer into a predetermined shape through etching, and a second cutting step of cutting, after the first cutting step, the insulating layer and the adhesive layer into the predetermined shape through etching.