The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Oct. 14, 2015
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Nanayakkara L. D. Somasiri, Austin, TX (US);

Paul V. Huynh, Pflugerville, TX (US);

Andrew C. Lottes, Austin, TX (US);

William L. Taylor, Round Rock, TX (US);

Levent Biyikli, Cedar Park, TX (US);

Carl E. Fisher, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01B 9/02 (2006.01); H01B 17/32 (2006.01); H01B 17/60 (2006.01); C09J 7/00 (2018.01);
U.S. Cl.
CPC ...
H01B 9/027 (2013.01); C09J 7/00 (2013.01); H01B 9/021 (2013.01); H01B 17/32 (2013.01); H01B 17/60 (2013.01); C09J 2203/302 (2013.01);
Abstract

An enhanced breakdown strength dielectric material includes a base dielectric layer having first and second opposing major surfaces. A first stress mitigating layer is disposed on the first major surface of the base dielectric layer. A second stress mitigating layer disposed on the second major surface of the base dielectric layer. A volume conductivity of at least one of the first and second stress mitigating layers is at least 2 times a volume conductivity of the base dielectric layer.


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