The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Nov. 18, 2014
Applicant:
Sunasic Technologies, Inc., New Taipei, TW;
Inventors:
Chi-Chou Lin, New Taipei, TW;
Zheng-Ping He, New Taipei, TW;
Assignee:
Sunasic Technologies, Inc., New Taipei City, TW;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); H01L 23/13 (2006.01); H05K 3/46 (2006.01); H01L 23/14 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); H01L 23/13 (2013.01); H01L 23/142 (2013.01); H05K 1/184 (2013.01); H05K 3/4644 (2013.01); H01L 23/49822 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/0002 (2013.01); H05K 3/321 (2013.01); H05K 2201/10151 (2013.01);
Abstract
A printed circuit board assembly (PCBA) and a method to assemble the PCBA are disclosed. The PCBA includes a printed circuit board (PCB), an image sensing chip and a protection layer. The PCB includes a first insulation layer, a second insulation layer, a first electrically conductive layer, a second electrically conductive layer, and a third electrically conductive layer. The image sensing chip has a number of bonding pads with a sensor portion facing down through the second opening. The PCBA can function as an image sensing module and make the module have the thinnest thickness.