The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Jun. 27, 2016
Applicant:

Amazon Technologies, Inc., Seattle, WA (US);

Inventors:

Hany Mounir Ghali, San Francisco, CA (US);

Siddharth Gupta, San Bruno, CA (US);

Assignee:

Amazon Technologies, Inc., Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G02F 1/1335 (2006.01); G02F 1/13357 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); G02F 1/1336 (2013.01); G02F 2001/133616 (2013.01); G06F 2203/04102 (2013.01);
Abstract

Electronic devices having a display stack that includes LED light sources combined with at least one other component layer are described. In some instances, the LED light sources are coupled to a dedicated touch sensor circuit layer, which removes an entire layer from the display stack. The touch sensor circuit layer can be installed with an addition portion of flexible printed circuitry extending the length of a lightguide and the LEDs can be installed on that flex. In other instances, particularly when the touch sensor layer is deposited directly on the interior surface of the cover glass, the LEDs can also be mounted to the glass itself, thereby potentially eliminating two layers from the display stack. While the elimination of any layers within the display stack enable the display stack to have a reduced thickness, there also are significant improves as a result of the elimination of the layers because there is a similar elimination of one or more flex printed circuits that must dealt with during the final assembly process of the electronic device itself.


Find Patent Forward Citations

Loading…