The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Oct. 03, 2014
Applicant:

Hyundai Motor Company, Seoul, KR;

Inventors:

Tae Oh Moon, Incheon, KR;

Dae Ik Jung, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D21H 27/38 (2006.01); D21F 7/08 (2006.01); B32B 5/02 (2006.01); B32B 5/22 (2006.01); B32B 5/26 (2006.01);
U.S. Cl.
CPC ...
D21H 27/38 (2013.01); B32B 5/022 (2013.01); B32B 5/22 (2013.01); B32B 5/26 (2013.01); D21F 7/083 (2013.01); B32B 2250/20 (2013.01); B32B 2262/0276 (2013.01); B32B 2307/102 (2013.01); B32B 2605/00 (2013.01);
Abstract

An apparatus and a method for manufacturing multilayer felt to improve NVH (noise, vibration, and harshness) of a vehicle may include supplying first chip felt between an upper mold and a lower mold, and simultaneously, firstly adsorbing the first chip felt on a bottom surface of the upper mold by vacuum pressure applied to vacuum suction gates of the upper mold, supplying second chip felt between the upper mold and the lower mold, and simultaneously, secondly adsorbing the second chip felt on a surface of the first chip felt by vacuum pressure applied to the vacuum suction gates of the upper mold, to stack the second chip felt on the first chip felt, pressing the first chip felt and the second chip felt, which are stacked on each other, using a press molding operation of the upper mold and the lower mold, and forming a multilayer felt product.


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