The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Jun. 06, 2017
Applicant:
Hexcel Composites Limited, Duxford, GB;
Inventor:
Mark Whiter, Saffron Walden, GB;
Assignee:
HEXCEL COMPOSITES LIMITED, Duxford, GB;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/26 (2006.01); B32B 5/08 (2006.01); B32B 3/10 (2006.01); B32B 3/26 (2006.01); B65H 18/28 (2006.01); B32B 17/06 (2006.01); B32B 17/02 (2006.01); B32B 5/02 (2006.01); B65G 59/00 (2006.01); B65H 16/00 (2006.01);
U.S. Cl.
CPC ...
B32B 5/26 (2013.01); B32B 3/10 (2013.01); B32B 3/26 (2013.01); B32B 5/02 (2013.01); B32B 5/08 (2013.01); B32B 17/02 (2013.01); B32B 17/067 (2013.01); B65G 59/00 (2013.01); B65H 16/00 (2013.01); B65H 18/28 (2013.01); B32B 2250/20 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/02 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/10 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2262/14 (2013.01); B32B 2307/542 (2013.01); B32B 2307/546 (2013.01); B32B 2307/72 (2013.01); B32B 2307/724 (2013.01); B32B 2307/732 (2013.01); Y10T 428/23979 (2015.04); Y10T 428/24802 (2015.01); Y10T 428/249921 (2015.04); Y10T 428/249953 (2015.04); Y10T 428/249979 (2015.04); Y10T 428/27 (2015.01);
Abstract
A curable sheet-like composite material comprising a layer of curable resin and at least one layer of structural fibres and comprising an outer backing layer of substantially resin-free material which is gas permeable but is substantially non-permeable with respect to the curable resin at room temperature.