The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Mar. 31, 2016
Industrial Technology Research Institute, Hsinchu, TW;
Nippon Electric Glass Co., Ltd., Shiga, JP;
Jyun-Kai Ciou, Changhua County, TW;
Yung-Min Hsieh, Hsinchu County, TW;
Kuo-Hsin Huang, Hsinchu County, TW;
Naotoshi Inayama, Shiga, JP;
Takehiko Isomoto, Shiga, JP;
Takahide Fujii, Shiga, JP;
Chang-Ying Chen, Kaohsiung, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Nippon Electric Glass Co., Ltd., Shiga, JP;
Abstract
A cutting method of a multilayer structure containing a brittle layer is provided. The cutting method includes: cutting the multilayer structure to form a cut edge; removing a material of the multilayer structure other than the brittle layer along the cut edge, wherein the material of the multilayer structure other than the brittle layer has a width ranging from 1 micron to 2 millimeter; and modifying an edge of the brittle layer remaining after removing the material of the multilayer structure other than the brittle layer by a laser beam.