The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

May. 20, 2015
Applicants:

Sylvia Monsheimer, Haltern am See, DE;

Maik Grebe, Bochum, DE;

Rainer Goering, Borken, DE;

Franz-erich Baumann, Duelmen, DE;

Inventors:

Sylvia Monsheimer, Haltern am See, DE;

Maik Grebe, Bochum, DE;

Rainer Goering, Borken, DE;

Franz-Erich Baumann, Duelmen, DE;

Assignee:

Evonik Degussa GmbH, Essen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/153 (2017.01); B22F 3/00 (2006.01); B22F 3/105 (2006.01); B28B 1/00 (2006.01); C04B 35/64 (2006.01); B23K 26/342 (2014.01); B23K 26/70 (2014.01); B29C 64/40 (2017.01); B29C 35/08 (2006.01); B33Y 30/00 (2015.01); B29C 64/129 (2017.01); B29C 64/165 (2017.01);
U.S. Cl.
CPC ...
B22F 3/003 (2013.01); B22F 3/1055 (2013.01); B23K 26/342 (2015.10); B23K 26/703 (2015.10); B28B 1/001 (2013.01); B29C 64/153 (2017.08); B29C 64/40 (2017.08); C04B 35/64 (2013.01); B22F 2003/1058 (2013.01); B29C 35/08 (2013.01); B29C 64/129 (2017.08); B29C 64/165 (2017.08); B33Y 30/00 (2014.12);
Abstract

The present invention relates to a process for the bonding of material for the production of three-dimensional objects by selective heating via a laser of wavelength from 100 to 3000 nm. The beam spot may be a focused or unfocused beam spot, or may indeed be spread, as is the case with the diode laser, where the bars may have a stacked arrangement. The selectivity of the melting process is achieved via the application of an absorber to certain subregions of a layer composed of a pulverulent substrate, and then heating of the absorber by laser radiation of wavelength from 100 to 3000 nm. The heated absorber transfers the energy present therein to its surrounding pulverulent substrate, which is melted thereby and, after cooling, has firm cohesive bonding.


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