The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Oct. 07, 2015
Applicant:

Mitsuba Corporation, Gunma, JP;

Inventors:

Takahiko Ogane, Kiryu, JP;

Fumiaki Koshio, Kiryu, JP;

Wataru Kusumoto, Kiryu, JP;

Masamichi Ishii, Kiryu, JP;

Yoshihisa Yamada, Kiryu, JP;

Iwao Tsurubuchi, Kiryu, JP;

Assignee:

Mitsuba Corporation, Gunma, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H01L 25/07 (2006.01); H02G 3/10 (2006.01); B29C 70/72 (2006.01); B29C 70/84 (2006.01); B29C 70/88 (2006.01); B29D 99/00 (2010.01); H01R 13/50 (2006.01); H01R 27/02 (2006.01); H01R 43/18 (2006.01); H05K 5/02 (2006.01); H05K 5/06 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0017 (2013.01); B29C 70/72 (2013.01); B29C 70/84 (2013.01); B29C 70/882 (2013.01); B29D 99/006 (2013.01); H01L 25/07 (2013.01); H01R 13/50 (2013.01); H01R 27/02 (2013.01); H01R 43/18 (2013.01); H02G 3/105 (2013.01); H05K 5/0034 (2013.01); H05K 5/0217 (2013.01); H05K 5/065 (2013.01); B29K 2995/0069 (2013.01); B29L 2031/3481 (2013.01);
Abstract

A controller () includes a primary molded portion () in which a resin molded body () is integrated with a bus bar () using a resin, causing one end of the bus bar () to function as a connector terminal which protrudes into connector portions () to (), and configured to form electronic component disposition portions (a) to (d) in which an electronic component () is disposed and a power device disposition portion () in which a power device () is disposed, and a secondary molded portion () integrated with the electronic component (), the power device (), and the primary molded portion () in a state in which the electronic component () is disposed at the electronic component disposition portions (a) to (d) and the power device () is disposed at the power device disposition portion ().


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