The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Jun. 23, 2015
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventor:

Thomas Wiesa, Vaihingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H01L 23/367 (2013.01); H05K 1/021 (2013.01); H05K 1/0206 (2013.01); H05K 1/0209 (2013.01); H05K 1/0271 (2013.01); H05K 1/181 (2013.01); H05K 2201/066 (2013.01); H05K 2201/09063 (2013.01);
Abstract

The arrangement relates to a circuit board having at least one electrically insulating layer and at least one electrically conductive layer. The circuit board has at least one heat-conducting element which is embedded in the electrically insulating layer and which is of thermally conductive form. The heat-conducting element is designed to transport heat losses transversely with respect to an areal extent of the circuit board. According to the arrangement, the heat-conducting element has at least two sub-elements formed in each case by a metal body. The heat-conducting element has an electrically insulating connecting layer which is arranged between the sub-elements and which is designed to electrically insulate the sub-elements with respect to one another and connect the sub-elements to one another in thermally conductive fashion.


Find Patent Forward Citations

Loading…