The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Jan. 27, 2017
Applicant:

Cirrus Logic International Semiconductor Ltd., Edinburgh, GB;

Inventors:

David Talmage Patten, Austin, TX (US);

Tsjerk Hans Hoekstra, Balerno, GB;

Assignee:

Cirrus Logic, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H04R 1/04 (2006.01); B81B 3/00 (2006.01); H04R 19/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 3/0021 (2013.01); B81B 7/0048 (2013.01); H04R 1/04 (2013.01); H04R 19/005 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/09 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS transducer () comprises a substrate () having a first surface () and a membrane () formed relative to an aperture in the substrate. The MEMS transducer () further comprises one or more bonding structures () coupled to the substrate, wherein the one or more bonding structures (), during use, mechanically couple the MEMS transducer to an associated substrate (). The MEMS transducer () comprises a sealing element () for providing a seal, during use, in relation to the substrate () and the associated substrate (). A stress decoupling member () is coupled between the substrate () and the sealing element ().


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