The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Nov. 18, 2016
Applicant:

National Chi Nan University, Puli, Nantou, TW;

Inventors:

Yo-Sheng Lin, Nantou, TW;

Chien-Chin Wang, Nantou, TW;

Assignee:

National Chi Nan University, Puli, Nantou, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 5/12 (2006.01); H03F 3/60 (2006.01); H03F 3/195 (2006.01); H03F 3/213 (2006.01); H03F 1/56 (2006.01);
U.S. Cl.
CPC ...
H03F 3/604 (2013.01); H03F 1/56 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H03F 2200/255 (2013.01); H03F 2200/423 (2013.01); H03F 2200/451 (2013.01);
Abstract

An RF power amplifier circuit includes a power divider, multiple power amplification circuits and a power combiner that cooperatively perform power amplification on an RF input signal so as to output an RF output signal, and an impedance conversion circuit that has a circuit terminal coupled to one of the power divider and the power combiner which has a microstrip structure, and that is configured such that a conversion impedance, which is an impedance seen into the impedance conversion circuit from the circuit terminal, matches an impedance seen into the power divider or the power combiner from the circuit terminal. The microstrip structure has a physical length associated with the conversion impedance.


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