The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
May. 24, 2017
Denso Corporation, Kariya, Aichi-pref., JP;
Tdk-micronas Gmbh, Freiburg, DE;
Toshiyuki Koumori, Kariya, JP;
Yoshiyuki Kono, Kariya, JP;
Tomoyuki Takiguchi, Kariya, JP;
Yoshinori Inuzuka, Kariya, JP;
Akitoshi Mizutani, Kariya, JP;
Seiji Nishimoto, Kariya, JP;
Camillo Pilla, Freiburg, DE;
DENSO CORPORATION, Kariya, JP;
TDK-MICRONAS GMBH, Freiburg, DE;
Abstract
A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.