The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Jan. 30, 2018
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi, JP;
Naoki Akiyama, Nisshin, JP;
Hiroki Tsuma, Okazaki, JP;
Takashi Kuno, Kariya, JP;
Toshitaka Kanemaru, Kariya, JP;
Kenta Hashimoto, Kariya, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
Abstract
A semiconductor device is provided with: a semiconductor substrate; a first electrode disposed on a surface of the semiconductor device and configured to be soldered to a conductive member; and a second electrode disposed on the surface of the semiconductor device and configured to be wire-bonded to a conductive member. The first electrode includes first, second and third metal layers. The second metal layer is located between the first and third metal layers. A metallic material of the second metal layer is greater in tensile strength than a metallic material of each one of the first metal layer and the third metal layer. The second electrode includes a layer made of a same metallic material as one of the first metal layer and the third metal layer, and does not include any layers made of a same metallic material as the second metal layer.