The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Jun. 20, 2016
Applicants:

Shanghai Tianma Am-oled Co., Ltd., Shanghai, CN;

Tianma Micro-electronics Co., Ltd., Shenzhen, CN;

Inventors:

Qi Li, Shanghai, CN;

Dong Qian, Shanghai, CN;

Duzen Peng, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/786 (2006.01); G02F 1/1362 (2006.01); G02F 1/1335 (2006.01); H01L 27/32 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1244 (2013.01); G02F 1/133514 (2013.01); G02F 1/136227 (2013.01); H01L 27/127 (2013.01); H01L 27/1222 (2013.01); H01L 27/1255 (2013.01); H01L 27/1288 (2013.01); H01L 29/78675 (2013.01); G02F 2001/13685 (2013.01); H01L 27/3262 (2013.01);
Abstract

The present disclosure provides an array substrate, including a substrate, a first functional layer configured on one side of the substrate, a first insulating layer configured on the first functional layer facing away from the substrate, a second functional layer configured on the first insulating layer facing away from the substrate, a second insulating layer configured on the second functional layer facing away from the substrate, a third functional layer configured on the second insulating layer facing away from the substrate, a third insulating layer configured on the third functional layer facing away from the substrate, a fourth functional layer configured on the third insulating layer facing away from the substrate, and a plurality of through-holes configured to electrically connect different functional layers, wherein the depth of any through-holes does not exceed the thickness of two adjacent insulating layers.


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