The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Feb. 19, 2016
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventor:
Naoya Takai, Yukuhashi Fukuoka, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 31/16 (2006.01); H01L 31/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/373 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 24/32 (2013.01); H01L 31/00 (2013.01); H01L 31/16 (2013.01); H01L 2224/32501 (2013.01); H01L 2224/32505 (2013.01); H01L 2924/06 (2013.01);
Abstract
According to one embodiment, a semiconductor device includes a first semiconductor element having a first surface, a second semiconductor element having a lower surface bonded to the first surface of the first semiconductor element, a gel-like silicone that covers an upper surface of the second semiconductor element, and a resin portion that covers the gel-like silicone and the first surface of the first semiconductor element.