The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Dec. 05, 2016
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Hidehiko Kira, Nagano, JP;

Naoaki Nakamura, Kawasaki, JP;

Sanae Iijima, Nagano, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 25/00 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 21/6838 (2013.01); H01L 21/78 (2013.01); H01L 23/295 (2013.01); H01L 23/3142 (2013.01); H01L 23/367 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75981 (2013.01); H01L 2224/81136 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/831 (2013.01); H01L 2224/9211 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/014 (2013.01); H01L 2924/04642 (2013.01); H01L 2924/05032 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/0715 (2013.01);
Abstract

An electronic device includes an electronic part including a first substrate having a group of first terminals over a first front surface and having a concavity in a back surface, a filler placed in the concavity, and a flat plate placed over the back surface with the filler therebetween, and further includes a second substrate disposed on the first front surface side of the first substrate and having a group of second terminals bonded to the group of first terminals over a second front surface opposite the first front surface. The filler and flat plate minimize deformation of the first substrate and variation in the distance between the group of first terminals and the group of second terminals caused by the deformation of the first substrate, which thereby reduces the occurrence of a failure in bonding together the group of first terminals and the group of second terminals.


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