The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Apr. 19, 2017
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01L 27/146 (2006.01); H04N 5/335 (2011.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 27/14636 (2013.01); H04N 5/335 (2013.01); H05K 1/11 (2013.01); H05K 1/181 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/1369 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/13691 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/061 (2013.01); H01L 2924/062 (2013.01); H01L 2924/066 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/07025 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01);
Abstract
A module, comprising an electronic component having a first electrode, a mounting board having a second electrode, a solder-bump configured to connect the first electrode and the second electrode, and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump, so as to form a space between the electronic component and the mounting board.