The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Nov. 03, 2016
Nxp B.v., Eindhoven, NL;
Sven Trester, Goessendorf, AT;
NXP B.V., Eindhoven, NL;
Abstract
An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate. The integrated circuit also includes a metallization stack located on a major surface of the semiconductor substrate. The metallization stack includes a plurality of metal layers including patterned metal features. Each metal layer of the metallization stack is separated by an intervening dielectric layer. The metallization stack forms a first grid including patterned metal features for supplying power and signal connections to components of the integrated circuit located in the semiconductor substrate. The metallization stack also forms a second grid for securing the integrated circuit against electromagnetic attacks. The second grid includes patterned metal features interspersed with the patterned metal features of the first grid in at least some of the metal layers of the metallization stack. The patterned metal features of the second grid are electrically connected to the first grid.