The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Jan. 23, 2013
Applicant:
Qualcomm Mems Technologies, Inc., San Diego, CA (US);
Inventors:
Ravindra V. Shenoy, Dublin, CA (US);
Kwan-Yu Lai, San Jose, CA (US);
Philip Jason Stephanou, Mountain View, CA (US);
Mario Francisco Velez, San Diego, CA (US);
Jonghae Kim, San Diego, CA (US);
Evgeni Petrovich Gousev, Saratoga, CA (US);
Assignee:
SnapTrack, Inc., San Diego, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); G09G 3/3266 (2016.01); H01L 25/00 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 25/10 (2006.01); H01L 23/31 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); G09G 3/3266 (2013.01); H01L 21/486 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/3121 (2013.01); H01L 23/49833 (2013.01); H01L 23/50 (2013.01); H01L 2224/16 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/1461 (2013.01);
Abstract
This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including package-on-packages (PoPs). The glass via bars can provide high density electrical interconnections in the PoPs. In some implementations, the glass via bars can include integrated passive components. Packaging methods employing glass via bars are also provided.