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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10115671 B1

PDFFull Text
Expired
Date of Patent:
Oct. 30, 2018

Filed:

Jan. 23, 2013

Incorporation of passives and fine pitch through via for package on package

Applicant:

Qualcomm Mems Technologies, Inc., San Diego, CA (US);

Inventors:

Ravindra V. Shenoy, Dublin, CA (US);

Kwan-Yu Lai, San Jose, CA (US);

Philip Jason Stephanou, Mountain View, CA (US);

Mario Francisco Velez, San Diego, CA (US);

Jonghae Kim, San Diego, CA (US);

Evgeni Petrovich Gousev, Saratoga, CA (US);

Assignee:

SnapTrack, Inc., San Diego, CA (US);

Attorney:

Weaver Austin Villeneuve & Sampson LLP

Primary Examiner:

Andres Munoz

Int. Cl.
CPC ...
H01L 23/538 (2006.01); G09G 3/3266 (2016.01); H01L 25/00 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 25/10 (2006.01); H01L 23/31 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); G09G 3/3266 (2013.01); H01L 21/486 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/3121 (2013.01); H01L 23/49833 (2013.01); H01L 23/50 (2013.01); H01L 2224/16 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/1461 (2013.01);
Abstract

This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including package-on-packages (PoPs). The glass via bars can provide high density electrical interconnections in the PoPs. In some implementations, the glass via bars can include integrated passive components. Packaging methods employing glass via bars are also provided.

Find Patent Forward Citations

Shenoy, Ravindra. (2018). Incorporation of passives and fine pitch through via for package on package (U.S. Patent No. 10115671). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10115671

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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