The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Sep. 20, 2017
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Teppei Akiyoshi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/002 (2006.01); H01G 2/04 (2006.01); H01G 2/06 (2006.01); H01G 4/012 (2006.01); H01G 4/008 (2006.01); H01G 4/258 (2006.01); H01G 4/33 (2006.01); H01G 4/12 (2006.01); H01G 4/248 (2006.01);
U.S. Cl.
CPC ...
H01G 4/232 (2013.01); H01G 2/04 (2013.01); H01G 2/06 (2013.01); H01G 4/002 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/258 (2013.01); H01G 4/33 (2013.01); H01G 4/1227 (2013.01); H01G 4/1236 (2013.01); H01G 4/248 (2013.01);
Abstract

A ceramic electronic component includes a multilayer body, an electronic component main body including first and second outer electrodes on the surface of multilayer body, a first substrate connection terminal bonded to at least one of the first outer electrode and the multilayer body by a bonding material that is electrically insulating, and a first metal terminal electrically connecting the first outer electrode and the first substrate connection terminal, in which, while the first metal terminal maintains an elastically deformed state, a first end portion thereof is bonded to the first outer electrode by an electrically conductive bonding material, and a second end portion thereof is bonded to the first substrate connection terminal by a bonding section with a different melting point from that of the bonding material.


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