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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10115522 B1

PDFFull Text
Date of Patent:
Oct. 30, 2018

Filed:

May. 26, 2016

Multi-layered dielectric polymer material, capacitor, use of the material and formation method thereof

Applicant:

Abb Schweiz Ag, Baden, CH;

Inventors:

Lejun Qi, Beijing, CN;

Nan Li, Beijing, CN;

Delun Meng, Beijing, CN;

Sari Laihonen, Västerås, SE;

Francois Delince, Biesme, BE;

Assignee:

ABB Schweiz AG, Baden, CH;

Attorney:

Taft Stettinius & Hollister LLP

Primary Examiner:

Eric Thomas

Assistant Examiner:

Arun Ramaswamy

Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/33 (2006.01); H01G 4/14 (2006.01); B32B 27/28 (2006.01); B32B 27/06 (2006.01); B29C 47/00 (2006.01); B29C 47/06 (2006.01); B29C 47/92 (2006.01); B32B 27/08 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); H01G 4/18 (2006.01); H01G 13/00 (2013.01);
U.S. Cl.
CPC ...
H01G 4/14 (2013.01); B29C 47/0021 (2013.01); B29C 47/0057 (2013.01); B29C 47/065 (2013.01); B29C 47/92 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/28 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B32B 27/322 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); H01G 4/18 (2013.01); H01G 4/306 (2013.01); B29C 2947/92152 (2013.01); B29C 2947/92647 (2013.01); B29K 2995/0006 (2013.01); B32B 2250/24 (2013.01); B32B 2255/24 (2013.01); B32B 2264/10 (2013.01); B32B 2270/00 (2013.01); B32B 2307/202 (2013.01); B32B 2307/204 (2013.01); B32B 2307/30 (2013.01); B32B 2307/514 (2013.01); B32B 2457/00 (2013.01); B32B 2457/16 (2013.01); B32B 2553/00 (2013.01); H01G 13/00 (2013.01);
Abstract

A multi-layered dielectric polymer material, a capacitor comprising the multi-layered dielectric polymer material, a use of the multi-layered dielectric polymer material and a method for forming the multi-layered dielectric polymer material are disclosed. The multi-layered dielectric polymer material may comprise a plurality of dielectric layers wherein the plurality of dielectric layers may comprise an identical base material. The base material may be compound with agents for at least one of the plurality of dielectric layers. It may overcome compatible issues for convention multi-layered material. The dielectric polymer material may have increased dielectric strength and excellent thermal properties.

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