The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Apr. 30, 2014
Hewlett Packard Enterprise Development Lp, Houston, TX (US);
Thomas Robert Bowden, Houston, TX (US);
Allen B Doerr, Magnolia, TX (US);
John Franz, Houston, TX (US);
Melvin K Benedict, Magnolia, TX (US);
Joseph Allen, Tomball, TX (US);
John Norton, Houston, TX (US);
Binh Nguyen, Houston, TX (US);
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Houston, TX (US);
Abstract
A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.