The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Jun. 29, 2015
Coretronic Corporation, Hsin-Chu, TW;
Chi-Chuan Wang, Hsin-Chu, TW;
Po-Sheng Huang, Hsin-Chu, TW;
Shang-Hsuang Wu, Hsin-Chu, TW;
Tsung-Ching Lin, Hsin-Chu, TW;
Wen-Yen Chung, Hsin-Chu, TW;
Jhih-Hao Chen, Hsin-Chu, TW;
Coretronic Corporation, Hsin-Chu, TW;
Abstract
A heat dissipation module includes a heat dissipation fin set. The heat dissipation fin set includes a plurality of heat dissipation fins, wherein these heat dissipation fins are stacked on each other, and each of the heat dissipation fins has a front side, a rear side opposite to the front side and at least one turbulent structure set. The turbulent structure set is located between the front side and the rear side and includes a plurality of first turbulent structures. The first turbulent structures are arranged from the front side to the rear side in sequence. A heat dissipation airflow flows from the front side toward the turbulent structure set along a flowing direction, and passes through the turbulent structure set to flow toward the rear side. An extending direction of each of the first turbulent structures is tilted relative to the flowing direction.