The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Mar. 15, 2016
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Masayasu Sakuma, Kamiina, JP;

Yoshihiro Kobayashi, Komagane, JP;

Shojiro Kitamura, Suwa, JP;

Taketo Chino, Hokuto, JP;

Michiharu Ogami, Sakata, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01C 19/5783 (2012.01);
U.S. Cl.
CPC ...
G01C 19/5783 (2013.01);
Abstract

A module includes a first rigid substrate including an analog circuit; a second rigid substrate including a digital circuit; a third rigid substrate including an angular velocity sensor; a first connecting portion that connects the first rigid substrate and the second rigid substrate so as to electrically connect the analog circuit and the digital circuit, and that has flexibility; and a second connecting portion that connects the first rigid substrate and the third rigid substrate so as to electrically connect the analog circuit and the angular velocity sensor, and that has flexibility.


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