The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Oct. 07, 2016
Applicant:

Ihi Corporation, Koto-ku, JP;

Inventors:

Kouichi Masuda, Tokyo, JP;

Hiroyuki Furukawa, Tokyo, JP;

Moe Kinoshita, Tokyo, JP;

Assignee:

IHI Corporation, Koto-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F01D 21/00 (2006.01); F01D 25/00 (2006.01); F02C 7/00 (2006.01); F02C 9/00 (2006.01); F02C 7/04 (2006.01); G05B 23/02 (2006.01); F02C 3/04 (2006.01);
U.S. Cl.
CPC ...
F01D 21/003 (2013.01); F01D 25/00 (2013.01); F02C 7/00 (2013.01); F02C 7/04 (2013.01); F02C 9/00 (2013.01); G05B 23/0235 (2013.01); F02C 3/04 (2013.01); F05D 2220/323 (2013.01); F05D 2260/80 (2013.01); F05D 2270/303 (2013.01); G05B 23/024 (2013.01);
Abstract

The failure detection device includes an accumulated data storage unit, a unit space generating module, a signal space generating moduleand a determining module, wherein the unit space generating moduleand the signal space generating moduleuse values as they are for condition sensor values defined as sensor values that affect other sensor values and sensor values that are not affected by the condition sensor values, and use values nondimensionalized by the condition sensor values or values adjusted by the condition sensor values for the other sensor values affected by the condition sensor values, and the determining modulecompares a distance between the unit space and the signal space and determines presence/absence of a possibility of a failure.


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